Fabrication and Investigation of Mechanical Properties of Copper Alloy Matrix Composite Reinforced with Micron Diamond Particles

Document Type : Original Article

Authors
1 Professor, Faculty of Materials and Manufacturing Technologies, Malek Ashtar University of Technology, Tehran, Iran.
2 Ph.D. Student, Faculty of Materials and Manufacturing Technologies, Malek Ashtar University of Technology, Tehran, Iran.
3 M.Sc. Graduate, Faculty of Materials and Manufacturing Technologies, Malek Ashtar University of Technology, Tehran, Iran.
Abstract
The aim of this research is to produce a copper alloy matrix composite reinforced with micron diamond partic­les and to investigate the mechanical properties of this composite. One of the most important issues in the manufacture of this type of composite is to optimize the strength of diamond particles in the metal matrix and the intended wear properties of this type of composite. The composite powders were produced using high-energy (abrasive) milling and hot-press sintering. In order to investigate the flexural strength, hardness and wear properties, samples were manufactured by adding different metals to the matrix, different milling conditions and different hot-pressing parameters. The aim of this research is to produce a copper alloy matrix composite reinforced with micron diamond particles and to investigate the mechanical properties of this composite. One of the most important issues in the manufacture of this type of composite is to optimize the strength of diamond particles in the metal matrix and the intended wear properties of this type of composite. The composite powders were produced using high-energy (abrasive) milling and hot-press sintering. In order to investigate the flexural strength, hardness, and wear properties, samples were fabricated by adding different metals to the matrix, using different milling conditions, and using different hot pressing parameters.
Keywords
Subjects

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  • Receive Date 04 August 2024
  • Revise Date 08 October 2024
  • Accept Date 20 October 2024
  • First Publish Date 20 October 2024
  • Publish Date 21 September 2024